发明名称 |
Controlling cumulative wafer effects |
摘要 |
A method and apparatus provided for controlling cumulative wafer effects. The method comprises processing a workpiece, determining a cumulative effect of the processing on the workpiece and comparing the determined cumulative effect to a reference target value. The method further comprises adjusting a downstream process of the workpiece based on comparing the determined cumulative effect to the reference target value.
|
申请公布号 |
US7069103(B1) |
申请公布日期 |
2006.06.27 |
申请号 |
US20020184814 |
申请日期 |
2002.06.28 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
BODE CHRISTOPHER A.;PURDY MATTHEW A. |
分类号 |
G06F19/00 |
主分类号 |
G06F19/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|