Fixing apparatus for mounting a heat sink to a printed circuit board

摘要

A fixing apparatus includes a retention module ( 10 ) and a back plate ( 30 ). The retention module is attached on a printed circuit board ( 20 ), which defines a plurality of through apertures ( 22 ). The retention module comprises a plurality of posts ( 12 ) depending therefrom. Each post is hollow and aligned with a corresponding through aperture. The back plate is attached on a bottom surface of the printed circuit board, for reinforcing the printed circuit board. The back plate comprises a plurality of upwardly extending poles ( 32 ). The poles extend through the through apertures and lock inside of the posts to secure the retention module and the back plate on opposites sides of the printed circuit board.