发明名称 |
Method of manufacturing a display device including forming electric connections on a substrate, conductor patterns on a second substrate and coupling the connections |
摘要 |
ICs ( 20 ) are nearly separated from the semiconductor substrate ( 10 ) on/in which they are formed. Subsequently, the substrate is positioned upside down on a substrate (carrier) ( 3 ) which is provided with glue ( 21 ) at the location of a crystal. After attachment of the crystal to the carrier, the semiconductor substrate is removed and the crystal remains attached to the carrier e.g. at the crossing of rows and columns. The separate crystals may contain TFTs (simple AM addressing) but also more complicated electronics (address of pixel in memory+identification). |
申请公布号 |
US7067338(B2) |
申请公布日期 |
2006.06.27 |
申请号 |
US20040787674 |
申请日期 |
2004.02.26 |
申请人 |
KONINKLIJKE PHILIPS ELECTRONICS N.V. |
发明人 |
LIFKA HERBERT;ROOZEBOOM FREDDY;ELFRINK RENE JOHAN GERRIT;JOHNSON MARK THOMAS |
分类号 |
G02F1/1368;H01L21/00;G02F1/1362;H01L21/44;H01L21/46;H01L21/48;H01L21/50;H01L21/78;H01L21/98;H01L27/15;H01L27/32 |
主分类号 |
G02F1/1368 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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