METAL SUBSTRATE DEVICE, IC CARD MODULE MANUFACTURING METHOD AND IC CARD MODULE BODY

摘要

PROBLEM TO BE SOLVED: To provide a metal substrate apparatus which can manufacture an IC card module for a non-contact IC card in higher mass-productivity, and to provide a method for manufacturing the IC card module.

SOLUTION: A metal substrate member comprises a plurality of metal substrates forming an IC card module used in manufacturing transfer mold-type non-contact IC cards. The metal substrate apparatus comprises a thin metal strip of processing material, and each metal substrate is held by a joint part. Each metal substrate has a die pad for loading an IC chip. Antenna terminals to connect antenna coils are located outside the die pad and a resin-sealed region. The antenna terminals of one metal substrate and those of a longitudinally adjacent metal substrate overlap a shared region of the processing material in a widthwise direction. The metal substrates can be separated by resin sealing and then making longitudinal cuts with a specified width on the processing material on the outer parts of the metal substrates along two connecting lines.

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