| 摘要 |
The module has a chip (1) fixed on a support (2) using glue (6). Contact surfaces (4) formed at a side of the support are electrically connected to the chip by a wire link (3). Raised contacts (8) are formed on contact points of the chip, where the points are arranged along a single line and the contacts act as contact surface for the link. The link is arranged on the raised contacts with a loop. |
