| 摘要 |
PROBLEM TO BE SOLVED: To provide a dicing method for mounting a wafer on a dicing tape to dice the wafer into semiconductor elements that can prevent an adhesive dicing trash from remaining on the surface of the semiconductor elements after the dicing. SOLUTION: Prior to a dicing step wherein a dicing blade B dices the wafer 1 along dicing lines 1b to separate the wafer 1 into each of the semiconductor elements 1a; the wafer 1 is mounted on the dicing tape 10, an ultraviolet ray P<SB>1</SB>is emitted to each of the dicing lines 1b in the wafer and extension parts of the dicing lines 1b existing in free regions of the dicing tape 10 at the outside of the wafer via a light shield mask M with linear pattern openings M<SB>1</SB>corresponding to the dicing lines 1b, to selectively decrease the adhering force of the dicing tape 10. COPYRIGHT: (C)2006,JPO&NCIPI |
