发明名称 DIE ATTACH FILM WITH DICING SHEET FUNCTION, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING FILM
摘要 PROBLEM TO BE SOLVED: To provide a die attach film with a dicing sheet function having high reliability with reduced interfaces by reducing the number of processes of a work during preparing the die attach film equipped with a dicing sheet function by making an adhesive layer a single layer. SOLUTION: The die attach film with dicing sheet function comprises a substrate film (I); an adhesive layer; a substrate film (II); and a film like adhesive layer arranged in this order, wherein an interface of the substrate film (II) on the side of the film like adhesive layer has been subjected to release processing. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006165074(A) 申请公布日期 2006.06.22
申请号 JP20040350555 申请日期 2004.12.03
申请人 SUMITOMO BAKELITE CO LTD 发明人 SASAKI AKITSUGU;NAKAGAWA DAISUKE
分类号 H01L21/301;H01L21/52 主分类号 H01L21/301
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