发明名称 HEAT TRANSFER BODY AND HEAT DISSIPATION STRUCTURE
摘要 PROBLEM TO BE SOLVED: To ensure excellent heat conductivity and improve vibration resistance. SOLUTION: There are provided a first face 52a and a second face 52b facing oppositely and making contact with a heating body 26 and a heat dissipation face 3, and a heat conductive body 53 formed into a sheet shape or a mesh shape by a conductive metal material and an elastically deformable cushion 54 are coupled. The heat conductive body includes a first surface part 53a exposed to the first face; a second surface 53b exposed to the second face, and a plurality of coupling parts 53c located between the first face and the second face for coupling the first surface and the second surface. The cushion is provided to embed respective spaces formed among the coupling parts. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006165060(A) 申请公布日期 2006.06.22
申请号 JP20040350280 申请日期 2004.12.02
申请人 SONY CORP 发明人 NAGASE KENICHI
分类号 H01L23/373;H05K7/20 主分类号 H01L23/373
代理机构 代理人
主权项
地址