| 摘要 |
PROBLEM TO BE SOLVED: To provide a 3-layer printed circuit board for high-frequency electronic circuits that sandwiches a metal foil between the upper and lower substrates (first substrate on which high-frequency generator circuits are formed and second substrate on which high-frerquency transmitter circuits are formed) for integration, contains a ground layer as an intermediate layer, and radiates high-frequency signals in an intended direction. SOLUTION: The printed circuit board is provided with a first printed circuit board with a copper foil layer in each side and many through-holes, and a second printed circuit board with a copper foil layer at either side. A second printed circuit board with the other side facing either side of the first printed circuit board and a first printed circuit board are laminated and hot-pressed with a prepreg between both boards, to produce a laminated body with many non-penetrating through holes that make conductive the copper foils at both sides of the first printed circuit board. Further, the circuit board has a high-frequency generator circuit formed at the other side of the first printed circuit board, and a high-frequency transmitter circuit formed at either side of the second printed circuit board. COPYRIGHT: (C)2006,JPO&NCIPI |
