| 摘要 |
PROBLEM TO BE SOLVED: To provide a sputtering apparatus capable of suppressing abnormal discharge by the stable discharge at low cost without being affected by the length of a power supply wire to connect a power supply device to a film deposition chamber. SOLUTION: The sputtering apparatus comprises DC power supply devices 1, 2 constituted as a power supply device for film deposition, power supply connecting means 6, 7 to connect the DC power supply devices to a film deposition apparatus in order to supply the DC power from the DC power supply devices to the film deposition apparatus, and a control unit including switch means 15, 16 to switch the polarity of the applied voltage provided on the film deposition apparatus side. The DC power supply is applied between a chamber 12 and a target 13 in the film deposition apparatus by switching the polarity of the applied voltage by the DC power supplied from the DC power supply device via the power supply connecting means by the switch means. COPYRIGHT: (C)2006,JPO&NCIPI
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