发明名称 |
Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool |
摘要 |
Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, a characteristic of a polishing pad, or a characteristic of a polishing tool are provided. One method includes scanning a specimen with a measurement device during polishing of a specimen to generate output signals at measurement spots on the specimen. The method also includes determining if the output signals are outside of a range of output signals. Output signals outside of the range may indicate that a parameter of the measurement device is out of control limits. In a different embodiment, output signals outside of the range may indicate damage to the specimen. Another method includes scanning a polishing pad with a measurement device to generate output signals at measurement spots on the polishing pad. The method also includes determining a characteristic of the polishing pad from the output signals.
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申请公布号 |
US2006131273(A1) |
申请公布日期 |
2006.06.22 |
申请号 |
US20060353899 |
申请日期 |
2006.02.14 |
申请人 |
KLA-TENCOR TECHNOLOGIES CORP. |
发明人 |
LEHMAN KURT;CHEN CHARLES;ALLEN RONALD L.;SHINAGAWA ROBERT;SETHURAMAN ANANTHA;BEVIS CHRISTOPHER F.;TRIKAS THANASSIS;CHEN HAIGUANG;MENG CHING L. |
分类号 |
C23F1/00;B24B37/04;B24B41/04;B24B49/04;B24B49/10;B24B49/12;B44C1/22;C03C25/68;H01L21/306 |
主分类号 |
C23F1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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