发明名称 CLEANING SOLVENT FOR SEMICONDUCTOR PRODUCTION APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a cleaning solvent, especially a solvent which is a resin composition cleaning solvent used for cleaning to remove the remaining resin composition and contains at least an alcoholic solvent of a boiling point of 100°C or higher. <P>SOLUTION: The cleaning solvent is a solvent containing at least an alcoholic solvent of a boiling point of 100°C or higher. It is desirable that the solvent is at least one member selected from among n-butyl alcohol, isobutyl alcohol, n-pentanol, 4-methyl-2-pentanol, and 2-octanol, and it is more desirable that the solvent is isobutyl alcohol. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2006160859(A) 申请公布日期 2006.06.22
申请号 JP20040353375 申请日期 2004.12.06
申请人 TOKYO OHKA KOGYO CO LTD 发明人 YOSHIDA MASAAKI;HIRANO TOMOYUKI
分类号 C11D7/26;C11D7/22;C11D7/50 主分类号 C11D7/26
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