| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive sheet by which dicing and die-bonding processes can be performed stably in a semiconductor manufacturing process. SOLUTION: The sheet for dicing and die-bonding of a semiconductor wafer comprises (1) a base film 1, (2) a sticking layer 2 formed at least on one plane of the base film, and (3) an adhesive layer 3 which is formed on the sticking layer and contains at least epoxy resin and an epoxy resin curing catalyst. The sticking layer 2 contains hydrogenated 1,2-polybutadiene resin and/or hydrogenated 1,2-polybutadiene derivative resin. COPYRIGHT: (C)2006,JPO&NCIPI |
