| 摘要 |
PROBLEM TO BE SOLVED: To effectively prevent generation of an abnormal particle or a frill on tin coating and also reliably prevent peel-off of a solder resist in a simple and convenient manner. SOLUTION: In a method for manufacturing a film carrier such as a printed circuit board, a flexible printed circuit board, etc. having a solder resist on a very fine pattern formed thereon; (a) an underlying tin coating is formed on a very fine pattern, (b) the underlying coating is heated, (c) an upper-layer tin coating is formed on the entire underlying tin coating, and (d) the upper-layer tin coating is coated with a solder resist. Because of a combination of the formation of the two-layer tin coatings and the heating of the underlying coating, an abnormal particle, etc. on the upper-layer tin coating can be preferably prevented. Since the two-layer tin coatings are formed and then covered with the solder resist, a problem with the peel-off the solder resist can be reliably solved in a simple and convenient manner. COPYRIGHT: (C)2006,JPO&NCIPI
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