| 发明名称 |
Electronic device, assembly and methods of manufacturing an electronic device |
| 摘要 |
A semiconductor substrate comprises both vertical interconnects and vertical capacitors with a common dielectric layer. The substrate can be suitably combined with further devices to form an assembly. The substrate can be made in etching treatments including a first step on the one side, and then a second step on the other side of the substrate.
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| 申请公布号 |
US2006131691(A1) |
申请公布日期 |
2006.06.22 |
| 申请号 |
US20050560717 |
申请日期 |
2005.12.15 |
| 申请人 |
KONINKLIJKE PHILIPS ELECTRONICS N.V. |
发明人 |
ROOZEBOOM FREDDY;BUIJSMAN ADRIANUS ALPHONSUS J.;GAMAND PATRICE;KEMMEREN ANTONIUS L.A.;HUBERT GERARDUS T.M. |
| 分类号 |
H01L29/00;H01L21/334;H01L21/768;H01L23/48;H01L27/08;H01L29/06;H01L29/94 |
主分类号 |
H01L29/00 |
| 代理机构 |
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