发明名称 |
Hot-Melt Underfill Composition and Methos of Application |
摘要 |
This invention provides a process for applying a wafer level underfill comprising: providing a solvent-free hot-melt underfill composition; melting the underfill; applying the underfill in a uniform layer to the active side of a semiconductor wafer; returning the underfill to a solid state; optionally B-staging the underfill; optionally removing any excess underfill from the bumps on the wafer; and dicing the wafer into individual dies.
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申请公布号 |
US2006134901(A1) |
申请公布日期 |
2006.06.22 |
申请号 |
US20050275080 |
申请日期 |
2005.12.08 |
申请人 |
NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION |
发明人 |
CHAWARE RAGHUNANDAN R.;HE XIPING;SHENFIELD DAVID |
分类号 |
H01L21/44 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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