| 摘要 |
PROBLEM TO BE SOLVED: To provide a higher-density wiring board by inhibiting spreading of a through-hole filler such as a conductive paste and miniaturizing via holes/wires, to provide a thin electrically insulating substrate, and to provide a manufacturing method of a thin wiring board excellent in productivity. SOLUTION: The electrically insulating substrate is formed by pasting a thermosetting resin onto a core through lamination, wherein the thermosetting resin is formed on a mold-releasing film. This prevents formation of voids at the interface between the mold-releasing film and the thermosetting resin and spreading of the conductive paste filled in the through-holes and enables formation of high-density via holes and manufacturing of the wiring board using the thin electrically insulating substrate with high productivity. COPYRIGHT: (C)2006,JPO&NCIPI |
