发明名称 RESIN MASK LAYER FORMING METHOD, INFORMATION RECORDING MEDIUM MANUFACTURING METHOD, AND RESIN MASK LAYER FORMING APPARATUS
摘要 PROBLEM TO BE SOLVED: To form a resin mask layer having a projecting and recessed pattern wherein the thickness of a residue and the height of projecting parts are uniform in the whole region while manufacturing costs are reduced. SOLUTION: When a resin mask 41 for etching treatment is formed, application treatment for applying a resin material on a surface of a stamper 20 on which the projecting and recessed pattern 31 is formed, a pasting treatment for pasting the layer of the resin material applied on the stamper 20 to an intermediate body 10 by pushing the resin material applied surface of the stamper 20 to the surface of the intermediate body 10 and peeling treatment for peeling the stamper 20 from a layer (a resin layer 22) of the resin material pasted to the intermediate body 10 are executed and curing treatment for curing the layer of the resin material applied on the stamper 20 is executed in the period from the time at which the application treatment is completed until the time at which the peeling treatment is started. Thus, the resin mask 41 comprising the layer (the resin layer 22) of the resin material formed by transferring the projecting and recessed pattern 20 of the stamper 20 onto the surface of the intermediate body 10 is formed. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006164365(A) 申请公布日期 2006.06.22
申请号 JP20040352196 申请日期 2004.12.06
申请人 TDK CORP 发明人 OKAWA SHUICHI;FUJITA MINORU;HATTORI KAZUHIRO
分类号 G11B7/26;B29C33/62;B29L17/00;G11B5/84 主分类号 G11B7/26
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