| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat sink for a semiconductor device for use in such a power electronic device as a laser diode (LD) or the like having a high calorific value that prevents the breakage and failure of a device, prevents the temperature distribution in the device in order to avoid a deteriorated characteristic of the device, and thereby achieves a high cooling efficiency. SOLUTION: Heat that is produced from an LD4 mounted on an end of the top face of a heat sink 1 formed of such a corruption-inhibiting material as copper or the like is conducted into a porous body 5 having refrigerant flow holes 5a provided in an intermediate refrigerant flow path 2c via a front wall 1c and an upper wall 1d of the heat sink 1. Such a refrigerant as water or the like that flows from an entrance side refrigerant flow path 2a to an exit side refrigerant side flow path 2b via the intermediate refrigerant flow path 2c absorbs the conducted heat when it passes through the refrigerant flow holes 5a in the porous body 5 that is provided in the intermediate refrigerant flow path 2c in the midstream, thus heat being dissipated. COPYRIGHT: (C)2006,JPO&NCIPI
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