| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for resin sealing electronic component module, by which an electronic component module can be sealed with a resin through a simple resin-sealing process, the resin-sealed surface can be planarized, and the variation in the thickness after the resin is cured can be suppressed, even when the resin-sealed thickness is large. SOLUTION: After a sealing resin 4 is injected into the opening 24 of a stencil-printing plate 12 having a groove by driving a squeegee 13, the resin 4 is packed in the opening 24 with a differential pressure, by actuating a vacuum pump 7 and compressor 17. Then the surface layer of the resin 4 is smoothed to adjust the sealing resin size to a prescribed value, by dipping the projection of the lower front end of a finishing squeegee 21 in the sealing resin 4 to a depth which is≤30% of the thickness of the stencil-printing plate 12, other than the groove and moving the squeegee 21 along the groove. COPYRIGHT: (C)2006,JPO&NCIPI
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