发明名称 METHOD AND APPARATUS FOR PREVENTING EROSION OF SOLDER BATH
摘要 PROBLEM TO BE SOLVED: To prevent erosion of a solder bath caused by lead-free solder. SOLUTION: The erosion preventing apparatus 12 is for preventing a solder bath 11 from being eroded by arsenic contained in a molten solder S. The apparatus 12 is equipped with a pipe 122 which is installed in the molten solder S and formed with a blowing port 121 for blowing air A, and a pump 123 which sends the air A into the pipe 122. The air A is pushed into the pipe 122 by the pump 123 and released into the molten solder S from the blowing port 121, resulting in the formation of an arsenic oxide. Consequently, the arsenic is eliminated that reacts with stainless steel of the solder bath 11, thereby preventing the erosion of the solder bath 11. Since the erosion preventing apparatus 12 has only to be installed in the molten solder S, the apparatus is also applicable to an existing solder bath. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006159225(A) 申请公布日期 2006.06.22
申请号 JP20040351932 申请日期 2004.12.03
申请人 TAMURA SEISAKUSHO CO LTD;TAMURA FA SYSTEM CO LTD;OSAKA UNIV 发明人 OKANO TERUO;IIJIMA MASAKI;YOSHIDA SHUNICHI;TAKEMOTO TADASHI;NISHIKAWA HIROSHI
分类号 B23K3/06;H05K3/34 主分类号 B23K3/06
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