| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a glass cap bonding method of curing an encapsulant distributed onto a metal line by irradiating only an encapsulant distributing region with ultraviolet rays. <P>SOLUTION: A glass cap bonding method comprises a process of forming many recesses 11A in the substrate corresponding part of a glass 11, a process of forming many non-light-transmitting layers 11B on the surface of the opposite part of the substrate corresponding part of the glass, a process of distributing an encapsulant S to the substrate bonding region of the glass 11 or the cap bonding region of the substrate, a process of bonding the glass 11 to the substrate 10 in such a state that each active region A that is formed on the substrate is stored in each recessed part of the glass, a process of curing the encapsulant S in the encapsulant distributing region by irradiating the upper part of the glass that is not bonded to the substrate 10 with ultraviolet rays, and a process of cutting the glass 11 and the substrate 10 that are bonded to make them into elements individually. Consequently, the ultraviolet rays irradiated to the active region of the substrate 10 are intercepted to protect the active region A, and the encapsulant S distributed on the metal line is completely cured. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
