| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laminated wiring board where the flip chip of an integrated circuit chip can easily be mounted, and a distance from a resistor and a capacitor from the integrated circuit chip can be shortened, and to provide a manufacturing method of the board. <P>SOLUTION: Via holes 20 and 141 to 143, through which the bump electrode 30 of the integrated circuit chip can be inserted are formed at a pitch that is the same as that of the bump electrode 30. Metal films 22 and 23 formed inside the via holes 20 and 141 to 143 and 162 are electrically connected to circuit layers 11, 12, 26 and 27. The built-in capacitor 32 is formed by the prescribed region 101 of a core insulating layer 10 and prescribed regions 112 and 126 of inner circuit layers 11 and 12, which sandwich the region 101 and face each other. The built-in resistor 13 is formed in the inner circuit layer 12. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
