| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device about which wiring formed on a substrate and a circuit pattern formed on the semiconductor element are firmly joined, an influence from an external load is reduced, and corrosion of the wiring and the circuit pattern are prevented, and to provide the manufacturing method for the semiconductor device. SOLUTION: A protection film 4 is formed on the surface of a semiconductor element 1 on whose surface wiring 2 is formed and on part of the wiring 2. Next, a circuit pattern 11 formed on a substrate 10 is mounted on the exposed wiring 2 and the protection film 4. Then, a laser beam 20 is irradiated to the part where the wiring 2 and the pattern 11 are brought into contact and to the part where the protection film 4 and the circuit pattern 11 are brought into contact to fuse the wiring 2 or the circuit pattern 11, thus joining the two. COPYRIGHT: (C)2006,JPO&NCIPI
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