| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic circuit board that employs a preflux substrate, contains lands difficult to be oxidized even when a standing time from reflow process to flow process is long or inspection work is conducted after the reflow process, ensures sufficient probe contact at inspection, and prevents solderability deterioration in the next flow process; and to provide a method for manufacturing the electronic circuit board. SOLUTION: A preflux substrate 90 used to manufacture electronic circuit boards 100 and 101 comprises a first land, of a circuit conductor 2 exposed on the surface, on which electronic components are soldered in the reflow process (not shown in Figure) and second lands 10 and 11 thereof on which electronic components are not soldered in the reflow process. The second lands 10 and 11 are coated by solders 10h and 11h. COPYRIGHT: (C)2006,JPO&NCIPI
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