发明名称 CHIP TYPE FUSE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a chip type fuse, and its manufacturing method, preventing current from flowing by fusion of a part of the wiring, instantaneously when a current larger than a rated current value flows instantaneously. SOLUTION: The chip type fuse 10a is provided with a substrate 1, copper foils consisting of electrode parts 31a, 31b and wiring parts 32a to 32c, and a tin plating 4 formed on a region of the wiring part 32c, as well as a resin layer formed by covering the wiring parts 32a to 32c and the tin plating 4. A slit 5a is formed penetrating the tin plating 4 and the wiring part 32c so that a wiring width of one part of the wiring part 32c with the tin plating 4 formed is to be narrower than that of the other wiring parts. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006164639(A) 申请公布日期 2006.06.22
申请号 JP20040351827 申请日期 2004.12.03
申请人 MITSUBISHI MATERIALS CORP 发明人 INABA HITOSHI
分类号 H01H85/046;H01H69/02;H01H85/045;H01H85/06;H01H85/10 主分类号 H01H85/046
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