| 发明名称 |
Carrier with metal bumps for semiconductor die packages |
| 摘要 |
A carrier for a semiconductor die package is disclosed. In one embodiment, the carrier includes a metal layer and a plurality of bumps formed in the metal layer. The bumps can be formed by stamping.
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| 申请公布号 |
US2006131747(A1) |
申请公布日期 |
2006.06.22 |
| 申请号 |
US20060342027 |
申请日期 |
2006.01.27 |
| 申请人 |
MADRID RUBEN |
发明人 |
MADRID RUBEN |
| 分类号 |
B21D22/02;H01L23/48;H01L21/48;H01L23/12;H01L23/498;H01L23/50 |
主分类号 |
B21D22/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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