摘要 |
One-component heat-curable sealant composition having a viscosity of at most 5 Pas (23° C.) for the protection of exposed dental surfaces, comprising (a) a polymerisable monomer and/or oligomer having at least two polymerizable double bonds per molecule, and (b) an initiator system comprising a thermally stable initiator having a 10 hour half-life decomposition temperature of from 95° C. to 135° (0.1M in benzene); wherein the composition further contains a precursor for a filler which is an alkoxysilane compound undergoing polycondensation reactions during heat curing of the composition, thereby forming a filler.
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