Baugruppenträger

摘要

The carrier board is provided by a multilayer substrate with a number of conductor path layers (41,42,45,46) separated by intermediate insulation layers (30) and having at least one separate section (2) from that provided with the control electronic circuit components, carrying further electrical or electronic components (12), which are coupled together and to the electronic circuit components. An INDEPENDENT CLAIM is also included for an application for a circuit group carrier board.