| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer printed-wiring board fitted to a high-density mounting by completely burying a via hole with a metal plating in the multilayer printed-wiring board widely used for various electronic equipment. <P>SOLUTION: A copper foil 4 with a resin is laminated on an internal layer material with a conductor pattern 2, the copper foil is removed, a non-through-hole is formed by a laser machining, and a via 7 is obtained by completely burying the non-through-hole by repeating the metal plating. A land 9 on a conductor pattern 8 for an external layer and the via 7 is formed by using a means such as a screen printing method, a photographing method on a surface, and the multilayer printed-wiring board 10 shown in Fig. (d) is manufactured. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
