发明名称 SOLID-STATE IMAGING DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a solid-state imaging device the sensitivity of which can be improved by improving the condensing efficiency of an on-chip lens. SOLUTION: The solid-state imaging device has a light-receiving section 2 formed on a substrate 1, and an on-chip lens 10 formed on the upper layer of the substrate 1 for condensing lights on the light-receiving section 2. The on-chip lens 10 is formed by laminating a plurality of lens layers, having a different refractive index so that the refractive index increases, going from the light entrance side to the substrate 1 side. For instance, the on-chip lens 10 has a first lens layer 11 having a relatively high refractive index, and a second lens layer 12 having a relatively low refractive index. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006165329(A) 申请公布日期 2006.06.22
申请号 JP20040355698 申请日期 2004.12.08
申请人 SONY CORP 发明人 SHIIBA TOMOHIRO
分类号 H01L27/14;H04N5/335;H04N5/369 主分类号 H01L27/14
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