| 摘要 |
PROBLEM TO BE SOLVED: To obtain an adhesive film that has slipperiness and is useful as an FPC substrate even in producing a dense circuit pattern. SOLUTION: The adhesive film has a highly heat-resistant polyimide layer and a thermoplastic polyimide-containing adhesive layer formed at least on one surface of the highly heat-resistant polyimide layer. The highly heat-resistant polyimide layer contains an inorganic filler and no inorganic filler having≥1μm median average diameter exists on the surface layer of the adhesive layer to solve the above-mentioned problem. COPYRIGHT: (C)2006,JPO&NCIPI
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