| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To achieve a small and simple cooling configuration in a semiconductor device having a semiconductor package formed by sealing a semiconductor chip connected with a heat sink of which the heat radiating surface is cooled by a coolant. <P>SOLUTION: A semiconductor device 100 has a semiconductor package having semiconductor chips 11, 12, heat sinks 20, 30 connected thermally to the semiconductor chips 11, 12, and mold resin 50 for sealing the semiconductor chips 11, 12 and heat sinks 20, 30 in an enclosing manner in a way of exposing heat radiating surfaces 21, 31 of the heat sinks 20, 30 of which the heat radiating surfaces 21, 31 are cooled by a coolant, wherein part of the mold resin 50 configures a through-hole 53 which is formed as a coolant channel 53 through which the coolant is flown. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
