发明名称 ELECTRONIC CIRCUIT SUBSTRATE, ITS MANUFACTURING METHOD, AND DISPLAY DEVICE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a flexible substrate high in connection reliability and capable of preventing disconnection defects from occurring even if repeatedly bent, its manufacturing method, and a display device using the substrate. SOLUTION: The flexible device is composed so that at least a part of a metal wiring 12 formed on the substrate is covered with a conductive polymer. Concretely, the metal wiring 12 is formed on the substrate 11. A conductive polymer wiring 13 is formed so as to cover a part on the wiring. The metal wiring 12 and the conductive polymer wiring 13 are made into a multi-layer structure. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006165341(A) 申请公布日期 2006.06.22
申请号 JP20040355815 申请日期 2004.12.08
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 HARADA TAKESHI;HOTTA SADAKICHI;TAKEUCHI TAKAYUKI;NANAI SATOSHIGE
分类号 H05K1/09;G09F9/00;G09F9/40;H01L21/288;H01L21/3205;H01L23/52;H01L51/50;H05K1/02;H05K3/12;H05K3/24 主分类号 H05K1/09
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