发明名称 |
ELECTRONIC CIRCUIT SUBSTRATE, ITS MANUFACTURING METHOD, AND DISPLAY DEVICE USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a flexible substrate high in connection reliability and capable of preventing disconnection defects from occurring even if repeatedly bent, its manufacturing method, and a display device using the substrate. SOLUTION: The flexible device is composed so that at least a part of a metal wiring 12 formed on the substrate is covered with a conductive polymer. Concretely, the metal wiring 12 is formed on the substrate 11. A conductive polymer wiring 13 is formed so as to cover a part on the wiring. The metal wiring 12 and the conductive polymer wiring 13 are made into a multi-layer structure. COPYRIGHT: (C)2006,JPO&NCIPI
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申请公布号 |
JP2006165341(A) |
申请公布日期 |
2006.06.22 |
申请号 |
JP20040355815 |
申请日期 |
2004.12.08 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
HARADA TAKESHI;HOTTA SADAKICHI;TAKEUCHI TAKAYUKI;NANAI SATOSHIGE |
分类号 |
H05K1/09;G09F9/00;G09F9/40;H01L21/288;H01L21/3205;H01L23/52;H01L51/50;H05K1/02;H05K3/12;H05K3/24 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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