| 摘要 |
PROBLEM TO BE SOLVED: To provide a relay substrate having superior high-frequency characteristics and being suitable for miniaturization. SOLUTION: When the number of spiral contacts 36 of a connecting means 22B that functions for signal is made larger than that of spiral contacts 30 of connection means 22A, 22C functioning for grounding, an inductance value on a signal line becomes small, and a characteristic impedance Z<SB>0</SB>of the relay substrate 20 can be reduced. The characteristic impedances Z<SB>0</SB>is made to match the impedance Zs and Z<SB>L</SB>of a signal source and a load, and thus, the problem of reflection can be solved, and the relay substrate 20 of superior high-frequency characteristics can be formed. Also, since impedance matching can be attained without requiring another member such as a coil of a capacitor, the relay substrate 20 can be miniaturized. COPYRIGHT: (C)2006,JPO&NCIPI
|
