发明名称 |
THERMOSETTING EPOXY RESIN COMPOSITION AND USE THEREOF |
摘要 |
<p>A liquid thermosetting epoxy resin composition which comprises: a main ingredient comprising an alicyclic epoxy compound having in the molecule a cyclic aliphatic skeleton and two or more epoxy groups and a polyol oligomer having two or more terminal hydroxy groups; a hardener; and a hardening accelerator. Alternatively, the composition comprises the main ingredient and a hardening catalyst. The liquid thermosetting epoxy resin composition is free from the problem that hardening results in the generation of a part having a hardening failure. Consequently, a cured resin obtained by curing the liquid thermosetting epoxy resin composition is optically homogeneous and has a low flexural modulus, a high flexural strength, a high glass transition temperature, and high transparency. It is suitable for use in optical semiconductors, etc.</p> |
申请公布号 |
WO2006064736(A1) |
申请公布日期 |
2006.06.22 |
申请号 |
WO2005JP22668 |
申请日期 |
2005.12.09 |
申请人 |
DAICEL CHEMICAL INDUSTRIES, LTD.;TAKAI, HIDEYUKI;HIRAKAWA, HIROYUKI |
发明人 |
TAKAI, HIDEYUKI;HIRAKAWA, HIROYUKI |
分类号 |
C08G59/40;C08L63/00;C08L67/00;C08L69/00;H01L23/29;H01L23/31 |
主分类号 |
C08G59/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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