| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To increase the throughput of manufacturing a microstructure. <P>SOLUTION: In a first material and a second material attached together, the first material is liable to be ablation with laser beams than the second material. In other words, the ablation threshold of the first material is higher than that of the second material. For example, the first material is silicon, and the second material is polymer-on-silicon consisting of polyimide. A removal process for performing the micro-working of opening a non-through hole in a laminate comprises a step of irradiating laser beams on the first material, and removing the material close to the interface of the two materials while a small amount of the first material is remained on a hole bottom, and a step of removing the rest of the first material by irradiating, from the second material side, laser beams of the intensity not influencing the second material, in other words, laser beams of the ablation influence lower than the ablation threshold of the second material. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
