| 摘要 |
PROBLEM TO BE SOLVED: To reduce the number of part items to connect easily between circuits using high-frequency signals. SOLUTION: An interconnection layer 22 and a ground layer 23 are provided in one surface of an insulation layer 21 and in the other surface thereof, respectively. The ground layer 23 is divided into ground layers 23a, 23b by a slit 31 provided in a direction perpendicular to the line direction of a signal line 22a formed in the interconnection layer 22. The signal line 22a is formed with an offset from the central axis of a line direction in the ground lines 23a, 23b to a direction perpendicular to the line direction. When signals have been input to the signal line 22a with the ground lines 23a, 23b grounded, a feedback current flows in the ground lines 23a, 23b. The lowpass filter is brought about on the interconnection board by setting outer circumferential lengths of the ground layers 23a, 23b as a length, in which a resonance is generated in the ground layers 23a, 23b when a signal with a frequency exceeding a desired frequency is input to the signal line 22a, e.g., half a wavelength of the desired frequency. COPYRIGHT: (C)2006,JPO&NCIPI
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