| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-speed machining method using coagulated fine particles, which achieves highly efficient machining of a semiconductor wafer inclusive of an Si wafer containing difficult-to-machine SiC etc., an EUVL optical element material such as Zerodur and ULE, etc., by taking advantage of no limitation in employing fine particles in a nozzle-type machining head system. SOLUTION: According to the high-speed machining method, a workpiece 2 and a nozzle-type machining head 1 are arranged in a machining container filled with a liquid mainly containing ultrapure water, across a predetermined interval, and a machining liquid which is obtained by dispersing the coagulated fine particles as an aggregate of a plurality of fine particles, in the ultrapure water, is ejected from the nozzle-type machining head to a surface of the workpiece, to thereby generate a shearing current of the machining liquid in the vicinity of the surface of the workpiece. Thus by virtue of the current of the machining liquid, the coagulated fine particles chemically reactive to the workpiece is supplied to the surface of the workpiece, and the coagulated fine particles chemically bonded to the workpiece are removed by the shearing current, so that atoms on the surface of the workpiece are removed, to thereby brings the machining to the following procedure. COPYRIGHT: (C)2006,JPO&NCIPI
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