发明名称 EPOXY-BASED CURABLE COMPOSITION AND ELECTRONIC PART
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an epoxy-based curable composition which can surely prevent undesired shortcircuiting between electrodes even when the pitch between the electrodes connected to the different electric potentials is caused to be narrow. <P>SOLUTION: The epoxy-based curable composition comprises an epoxy compound and a curing agent A which is incompatible with the epoxy compound and gives a particle size, when dispersed in the epoxy-based curable composition, of at most X/3 where X is the pitch between electrodes connected to the different electric potentials. The electronic part comprises a substrate and, arranged thereon, a plurality of electrodes 11 and 12 formed so that the distance between the electrodes 11 and 12 connected to the different electric potentials is X, where the cured product of the epoxy-based curable composition is applied so that it extends over the electrodes 11 and 12. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2006160913(A) 申请公布日期 2006.06.22
申请号 JP20040355605 申请日期 2004.12.08
申请人 SEKISUI CHEM CO LTD 发明人 WATABE KOJI
分类号 C08G59/50;H01L23/29;H01L23/31 主分类号 C08G59/50
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