发明名称 |
PACKAGE FOR LIGHT EMITTING DEVICE AND METHOD FOR PACKAGING THE SAME |
摘要 |
There are provided a light emitting device package and a method for manufacturing the same. The light emitting device includes: a plurality of barriers provided above a metal circuit board; a plurality of light emitting devices placed in a space between the barriers; and a lens unit provided at an upper side of the barrier. Accordingly, the plurality of light emitting devices can be conveniently seated as a module format, and a luminance can be increased. Also, an efficiency of heat sink can be increased. |
申请公布号 |
WO2006064996(A1) |
申请公布日期 |
2006.06.22 |
申请号 |
WO2004KR03565 |
申请日期 |
2004.12.31 |
申请人 |
LG INNOTEK CO., LTD;PARK, JUN SEOK |
发明人 |
PARK, JUN SEOK |
分类号 |
H01L33/54;H01L33/58;H01L33/62 |
主分类号 |
H01L33/54 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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