| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a highly productive wire bonding method with a plurality of rows of unit semiconductor chip mounting frames arranged in a single row for reliably wire-bonding a lead frame or a wiring board having a conveyed semiconductor chip mounted with the semiconductor chip. <P>SOLUTION: The method is for carrying a semiconductor chip mounting frame 13 having a plurality of rows of unit semiconductor chip mounting frames each with a semiconductor chip 12 mounted, and for wire-bonding an electrode of the semiconductor chip 12 with a lead of the frame 13 by a bonding device 11. The bonding device 11 is provided at a predetermined position on either side of a bonding line for wire-bonding by moving a bonding head 15 only in a bonding region of the unit semiconductor chip mounting frame. When the above step is completed, the adjacent unit semiconductor chip mounting frame in the row direction or in the breadthwise direction is carried to below the bonding head 15 for wire-bonding. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
