| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem, wherein a capacity element for cutting a noise signal arranged in an active-element input requires a large area including parts, such as wiring, that is required for forming the capacity element and obstructs miniaturization of a chip size in a microwave integrated circuit. SOLUTION: The capacity element, formed on the rear of a chip, has a structure connecting either of two electrodes for the capacity element directly under one terminal for a semiconductor device, and the capacity element directly under one terminal for the semiconductor device. The upper section of the plane of a semiconductor surface is coated with a gate metal, and a semiconductor substrate and active regions other than transistor active regions are removed from the rear surface. COPYRIGHT: (C)2006,JPO&NCIPI |
