| 摘要 |
PROBLEM TO BE SOLVED: To enable manufacturing a multilayer wiring board having dimension stability which will not cause wrinkle or unevenness by preventing a product, after molding (copper foil cladding) from adhering to a stainless plate. SOLUTION: A method of manufacturing the multilayer wiring board has a process of forming an insulating layer 5 on a base on which bumps 4 for interlayer connection are formed, a process of sandwiching the base with stainless plates 22 and thermocompression-bonding the copper foil 3 onto the insulating layer 5, and a process of patterning the copper foil 3. In thermocompression bonding of the copper foil, a release layer is formed on at least the each of surface of the stainless plates 22, where the stainless plate 22 faces the copper foil 3. The release layer is formed of a composite plating layer etc., such as a composite layer of nickel and tungsten. COPYRIGHT: (C)2006,JPO&NCIPI |
