| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a substrate for a printed wiring board that reduces temperature variations in a pressing heating platen and a laminated construct even if heating steam is used as a heat source. SOLUTION: In the manufacturing method, a plurality of sets of laminated constructs, each of which comprises a prepreg and a metal foil that are laminated on the surface of an internal layer circuit board in this order from the surface side of the internal layer circuit board, are laminated, sandwiched between pressing heat platens that use heating steam as a heat source, heated, pressurized, and integrated. Initial heating is performed intermittently. Specifically, the injection of 100 to 140°C steam and the suspension thereof are repeated. The time of suspension of injecting steam is 20 minutes or less. In addition, a gas is blown into a steam path before a next steam injection. COPYRIGHT: (C)2006,JPO&NCIPI |
