发明名称 CIRCUIT WIRING BOARD AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a circuit wiring board and its manufacturing method which mechanically and electrically surely and tightly connects a plurality of wiring layers provided on both sides of an insulation board and inter-layer electric paths (inter-layer wirings) between the wiring layers. SOLUTION: The circuit wiring board comprises an insulation board 1, a first and second wiring layers 2, 3 respectively provided on both sides of the board 1 for forming circuit wiring patterns, and inter-layer electric paths 4 composed of formed metal pieces 6 each having an approximately conical longitudinally sectional shape buried through a part of the insulation board 1 for electrically connecting the first and second wiring layers 2, 3. The cone bottom face of the formed metal piece 6 of the inter-layer electric path is connected to the first wiring layer with a conductive adhesive layer 5, and a part of the metal piece 6 at the cone top side is pressure-bonded to the second wiring layer 3. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006165282(A) 申请公布日期 2006.06.22
申请号 JP20040354892 申请日期 2004.12.08
申请人 FUJIKURA LTD 发明人 OBARA TOSHIHIKO;UNAMI YOSHIHARU;INATANI YASUSHI
分类号 H05K1/11;H05K3/40 主分类号 H05K1/11
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