| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealing epoxy resin composition excellent in fluidity and good in reliability such as reflow resistance, moisture resistance, and high-temperature standing characteristics and suitable for sealing a semiconductor such as VLSI and to provide an electronic component device equipped with an element sealed with the composition. SOLUTION: The sealing epoxy resin composition is an epoxy resin composition comprising (A) an epoxy resin and (B) a curing agent, wherein the ring opening degree of epoxy groups after melt kneading is below 5%, and the glass transition temperature is below 25°C. COPYRIGHT: (C)2006,JPO&NCIPI
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