PCB, manufacturing method thereof and semiconductor package implementing the same

摘要

A method may involve providing a substrate body having an upper surface and a lower surface. Circuit layers may be provided on the upper and the lower surfaces of the substrate body. A prepreg layer may be provided on the upper surface of the substrate body. The prepreg layer may cover the circuit layer on the upper surface. A PCB may be manufactured according to the method. The PCB may be implemented in a semiconductor package.