| 摘要 |
An electric apparatus includes a semiconductor device, a printed substrate, a shield case, a thermally conductive sheet, and a heat radiation member. The semiconductor device is mounted on the printed substrate stored in the shield case. The shield case has a hole portion opened toward the semiconductor device. The thermally conductive sheet is attached to the semiconductor device disposed in a position opposed to the hole portion. The heat radiation member is attached to the hole portion, an inner end portion abuts on the thermally conductive sheet, and an outer end portion protrudes out of the shield case. Heat generated in the semiconductor device is released to the outside of the shield case via the thermally conductive sheet and the heat radiation member.
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