| 发明名称 |
Method of making circuitized substrate |
| 摘要 |
A method of making a circuitized substrate comprising a first layer comprised of a dielectric material including a resin material including a predetermined quantity of particles therein and not including continuous fibers, semi-continuous fibers or the like as part thereof, and at least one circuitized layer positioned on the dielectric first layer.
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| 申请公布号 |
US2006131755(A1) |
申请公布日期 |
2006.06.22 |
| 申请号 |
US20060349990 |
申请日期 |
2006.02.09 |
| 申请人 |
ENDICOTT INTERCONNECT TECHNOLOGIES, INC. |
发明人 |
JAPP ROBERT;MARKOVICH VOYA;PALOMAKI CHERYL;PAPATHOMAS KOSTAS;THOMAS DAVID L. |
| 分类号 |
H01L23/48;H01L21/44;H01L21/48;H01L21/50;H01L23/14;H01L23/492;H01L23/498;H01L23/52;H01L29/40;H05K1/03;H05K3/00;H05K3/46 |
主分类号 |
H01L23/48 |
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